Encapsulation & Potting Resins
Resin systems are made for the purpose of protecting and insulate printed circuit boards (PCBs) and
electronic components from the dangers of harsh and challenging environments including moisture,
vibration, thermal or physical shock, and general contamination. Encapsulating components or coating the
entire device with resins can form a complete barrier against these environments and provide superior
performance.
The Range of encapsulation & potting resins available includes epoxy, polyurethane and silicones.
- a. Epoxy Potting Resin AEP305: EP305 is a two-component epoxy encapsulant that cures at room temperature. The product has the characteristics of low viscosity, excellent electrical characteristics, good flexibility, and is suitable for potting motor coils, small transformers, transformer coils, motorcycles, automobile ignition coils.
- b. Epoxy Potting Resin AEP288: AEP288 is a general purpose, two-part potting and encapsulating compound. The system utilizes a hardener free of DDM or other aromatic amines. The flame retardant technology used is of a ‘clean’ type leading to relatively low toxicity fumes and low smoke emission.
- c. Clear Epoxy Compound ASPC_275: ASPC_275 is a water-clear epoxy resin developed to offer unrivalled clarity and bubbles free in electronic components and all other substrates. This has been formulated for maximum compatibility with a wide range of substrates and mould materials. It can be used for just about any application that requires a water-clear bubbles free and tough resin casting. It is easy to use, low odour and self-degassing. As such flatting and polishing of the cured open surface will usually be required in order to achieve a perfectly smooth gloss finish.
- d. Polyurethane potting resin APU04H: APU04H is a two-component solvent-free polyurethane potting resin mainly used in Tyre Pressure Monitoring System (TPMS). The product has excellent insulation, bonding performance to most substrate. It is especially suitable for harsh environment (such as wet, vibration and corrosive places) and where devices are protected from extreme temperature cycle or cold and heat impact. It is suitable for the potting and packaging of various electronic components, sensors, microcomputer control boards, etc.
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